AMAOE OV-2 0.12mm MSM8916 MSM8939 MSM8940 CPU BGA Reballing Stencil for OPPO and VIVO

AMAOE OV-2 0.12mm MSM8916 MSM8939 MSM8940 CPU BGA Reballing Stencil for OPPO and VIVO

β‚Ή179.00
Brand:
Model: OV-2
Availability: In Stock
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Product Description

The AMAOE OV-2 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible OPPO and VIVO smartphones using the supported Qualcomm processor layouts.

Key Features

  • Brand: AMAOE
  • Model: OV-2
  • Thickness: 0.12mm
  • Type: CPU BGA reballing stencil
  • Supported Processors: Qualcomm MSM8916, MSM8939 and MSM8940
  • Compatible Brands: OPPO and VIVO
  • Application: CPU reballing and smartphone motherboard repair

The stencil helps technicians align solder balls or solder paste with the matching BGA layout during chip rework.

Compatibility Note: Verify the processor marking and stencil pattern before use to ensure compatibility with the motherboard being repaired.

🚚 Shipping & Delivery Information

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